| Title |
Development of Tubeless-Packaged Field Emission Display |
| Authors |
주병권(Ju, Byeong-Gwon) ; 이덕중(Lee, Deok-Jung) ; 이윤희(Lee, Yun-Hui) ; 오명환(O, Myeong-Hwan) |
| Keywords |
glass-to-glass bonding ; electrostatic bonding ; field emitter array ; FED tubeless packaging ; field emission display |
| Abstract |
The glass-to-glass electrostatic bonding process in vacuum environment was developed and the tubeless-packaged FED was fabricated based on the bonding process. The fabricated tubeless-packaged FED showed stable field emission characteristics and potential applicability to the FED tubeless packaging and vacuum in-line sealing. |