| Title |
Chemical Mechanical Polishing Characteristics with Different Slurry and Pad |
| Keywords |
Chemical mechanical polishing (CMP) ; high selectivity slurry (HSS) ; shallow trench isolation (STI) ; global planarization ; reproducibility |
| Abstract |
The chemical mechanical polishing (CMP) process is now widely employed in the ultra large scale integrated (ULSI) semiconductor fabrication. Especially, shallow trench isolation (STI) has become a key isolation scheme for sub-0.13/0.10μ{ textrm} m CMOS technology. The most important issues of STI-CMP is to decrease the various defects such as nitride residue, dishing, and tom oxide. To solve these problems, in this paper, we studied the planarization characteristics using slurry additive with the high selectivity between SiO_2 and Si_3N_4 films for the purpose of process simplification and in-situ end point detection. As our experimental results, it was possible to achieve a global planarization and STI-CMP process could be dramatically simplified. Also, we estimated the reliability through the repeated tests with the optimized process conditions in order to identify the reproducibility of STI-CMP process. |