| Title |
A Study on the Recycling of Silica Slurry Abrasives by Filtering |
| Authors |
서용진(Seo Yong-Jin) ; 박성우(Park Sung-Woo) ; 이우선(Lee Woo-Sun) |
| Keywords |
CMP(Chemical Mechanical Polishing) ; Abrasive Particles ; COO(Cost of Ownership) COC(Cost of Consumables) |
| Abstract |
In this paper, in order to reduce the high COO (cost of ownership) and COC (cost of consumables), we have collected the silica abrasive powders by filtering method after subsequent CMP (chemical mechanical polishing) process for the purpose of abrasives recycling. And then, we have studied the possibility of recycle of reused silica abrasive through the analysis of particle size distribution and FE-SEM (field emission-scanning electron microscope) measurements of abrasive powders. It was annealed the collected abrasive powders to promote the mechanical strength of reduced abrasion force. Finally, we compared the CMP characteristics between self-developed KOH-based silica abrasive slurry and original slurry. As our experimental results, we obtained the comparable rate of removal and good planarity with commercial products. Consequently we can expect the saving of high cost slurry. |