| Title |
New High-Frequency Equivalent Circuit Model for QFP Package |
| Authors |
김성종(Kim Sung-Jong) ; 송상헌(Song Sang-Hun) |
| Keywords |
QFP ; Bonding Wire ; Lead Frame ; S-parameters ; Radio Frequency |
| Abstract |
We present a new high-frequency equivalent circuit model for 52pin QFP used in typical IC's and extract R, L, and C values of this circuit model using a 3-D E & M field simulator. Futhermore, L and C value variations as a function of Pin number due to the shape differences of the leads have been fitted to 2nd order polynomials in order to extend the applicability of this model. |