| Title |
Partially Hollow Substrate Integrated Waveguide and 1:2 Traveling-Wave Power Combiner using 3D Printing |
| Authors |
한성희(Seong-Hee Han) ; 성하욱(Ha-Wuk Sung) ; 김동욱(Dong-Wook Kim) |
| DOI |
https://doi.org/10.5370/KIEE.2021.70.8.1188 |
| Keywords |
3D printing; Dielectric constant; Loss tangent; Substrate integrated waveguide; Power combiner |
| Abstract |
In this paper, we propose a partially hollow microstrip line(PHMLIN), partially hollow substrate integrated waveguide(PHSIW) and their transition that are implemented using the 3D printing techniques of light induced planar solidification(LIPS) and metal line printing. A partially hollow structure uses a resin substrate whose most part is removed and filled with air. Although they are implemented on a relatively lossy substrate, the PHMLIN and PHSIW show better transmission performance, compared with other conventional microstrip line and substrate integrated waveguide(SIW). The PHMLIN-PHSIW transition has an insertion loss of about 0.2 dB at 7 GHz. Using the proposed 3D printed structures, a 1:2 traveling-wave power combiner is demonstrated, and shows an insertion loss of less than 0.87 dB and a power combining efficiency of 82.1~87.9% in 6.5~7.5 GHz. The proposed structures using 3D printing are very useful for small quantity batch production of microwave components. |